Electronic Design,
Firmware and Software

A team of young engineers led by people with different experience listens to the needs of the customer and proposes some solutions, always guided by the simplicity of use that the product must have, the ease of construction, the continuity of production and costs.

For each project the team leader will guide the defined team keeping the client with whom to share the development in constant updating.

Master

After the electronic design the master is realized using the most modern routing systems, also providing the 3D of the card for the correct evaluation of the overall dimensions.

PCB

Production organization, state-of-the-art facilities and staff with many years of experience allow us to supply rigid, flexible and rigid flexible pcb with these characteristics.

TECHNOLOGY

  • RIGID, FLEX AND RIGID-FLEX
  • DOUBLE LAYER, MULTILAYER FOR BACK PANELS CONTROLLED IMPEDANCE MULTILAYER
  • BLIND VIAS - BURIED VIAS
  • MICRO VIAS AND PRESS-FIT

FINISHES

  • HAL LEAD FREE
  • CHEMICAL GOLD -GALVANIC GOLD
  • CHEMICAL TIN

CAPABILITY

  • MAX LAYERS 24
  • MIN/MAX THICKNESS 0.33 – 4,8 mm
  • FINAL THICKNESS TOLERANCE +- 7%
  • MIN INNERLAYER THICKNESS 0.05 mm
  • WARPING 0.5%
  • LARGHEZZA PISTE-ISOLAMENTI 50 micron
  • TRACK/ISOLATION WIDTH 50 micron
  • CONTROLLED IMPEDANCE
  • FINISHED VIA MIN 0.15 mm
  • ASPECT RATIO 2:12 LASER DRILLING

Contact us for more information

We'll be happy to answer your requests

  • Via della Scienza, 50 - 41122 Modena - Italy
  • C.F. e P.IVA 01579050368
  • Iscrizione Registro Imprese Modena n. REA 227319
  • +39.059.289811
  • +39.059.289861
  • techboardgroup [@] techboardgroup.com